Solution Architect leading design and delivery of Azure services for Pearson's educational platforms. Collaborating with teams to create scalable and secure solutions.
About the role
- R&D Engineer leading advanced 3D Heterogeneous Integration initiatives for GlobalFoundries. Focused on process development and collaboration for advanced packaging solutions in semiconductor manufacturing.
Responsibilities
- Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines.
- Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs.
- Collaborate joint development projects with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes.
- Drive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs.
- Develop expertise in processes, materials, and tooling, and make efficient use of characterization resources.
- Drive data analysis, interpretation of results, and understanding of failure modes.
- Identify and resolve process integration issues and related challenges.
- Generate IP related to novel wafer integration and packaging technology.
Requirements
- Education – Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
- MS degree with at least 5-6 years of prior related work experience.
- In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
- Strong problem solving and technical trouble shooting skills including expertise in design of experiment.
- Must have at least an overall 3.0 GPA and proven good academic standing.
- Language Fluency - English (Written & Verbal).
Benefits
- Health insurance
- Retirement plans
- Professional development opportunities
- Paid time off
- Flexible work hours
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