Package Design Engineer at Teledyne e2v leading the design flow of microelectronic packages. Coordinating with teams and vendors to ensure successful design and implementation processes.
About the role
- Analog and Mixed Signal Design Engineer at Intel developing and testing circuit blocks for advanced technology. Collaborating with engineers on process technology and circuit specifications.
Responsibilities
- Developing, designing and testing circuit blocks including wireline IO AFEs, clocking circuits, and voltage regulator circuits.
- Integrating them into Intel's leading technology test chips.
- Capturing design and measurement results to guide the next generation of process technology and circuit specifications based on requirements for SoC building blocks and critical wireline interfaces.
- Working closely with process and IP engineers to anticipate AMS IP requirements and use design and test results to inform and accelerate process technology and product development.
Requirements
- Bachelor’s degree in Electrical, Computer or Electrical and Computer Engineering, or related STEM field with 10+ years of experience, OR Master’s degree in Electrical, Computer or Electrical and Computer Engineering, or related STEM field with 8+ years of experience, OR Ph.D. in Electrical, Computer or Electrical and Computer Engineering, or related STEM field with 3+ years of experience.
- Experience with design of custom analog or mixed-signal circuits.
- Analog or mixed signal design skills including specification, design or verification.
- Preferred: Experience in one or more of the following areas: GPIOs, high speed parallel or serial IO links and their subcomponents (data path, TX, RX, etc.), clock distribution, clock conditioning, clock recovery circuits, voltage regulators, voltage reference circuits, ADCs/DACs, inductors, transmission lines, RF and millimeter-wave circuits, test of custom analog and mixed-signal circuits.
Benefits
- competitive pay
- stock bonuses
- health
- retirement
- vacation
Job title
Job type
Experience level
Salary
Degree requirement
Location requirements
Electrical Design Engineer focusing on frequency converters at Comatec. Work involves design, collaboration with clients, and development of existing systems.
Silicon Packaging Design Engineer at Intel driving development for mask and panel designs. Implementing layout, performance studies and conducting reviews for substrate designs.
SoC Physical Design Engineer working on Intel's next generation Client CPU SoC with complex structural designs. Collaborating with various stakeholders on implementation and verification processes.
Design Engineer responsible for collaborating on designs for exhibits and corporate environments at STAR. Leading project planning and execution with a focus on client satisfaction and timelines.
Structural Design Engineer at Nucor responsible for designing safe and economical metal building systems. Collaborating with teams and ensuring structural integrity and compliance with industry standards.
Mechanical Design Engineer developing systems for spacecraft like the Blue Ring at Blue Origin. Involved in the design cycle from conceptualization to qualification of flight hardware.
Jr. Hardware Design Engineer at SilverEdge developing solutions for DoD and Intelligence Community. Seeking talent with electrical engineering background and programming skills.
Electrical Engineer designing mixed signal hardware for Raytheon's Radar systems. Responsible for circuit card assemblies and collaborating with cross - functional teams.
Hardware Engineer developing transceivers for Coherent while collaborating with cross - functional teams and ensuring adherence to industry standards. Responsible for design verification testing and documentation for firmware integration.