Electrical Design Engineer focusing on frequency converters at Comatec. Work involves design, collaboration with clients, and development of existing systems.
About the role
- Package Design Engineer at Teledyne e2v leading the design flow of microelectronic packages. Coordinating with teams and vendors to ensure successful design and implementation processes.
Responsibilities
- Management of the full design flow of organic and ceramic multi-layers microelectronics packaging (BGA, PGA, CLCC, CQFP, WLCSP)
- Identify customers’ needs.
- Devise a solution and a specification.
- Interact with packaging manufacturers to obtain a solution and a quote all along the design process.
- Interacting with project teams (sensor designers, project manager…)
- Implement the design + routing of the package in accordance with the constraints and timing as originally defined.
- Conduct electrical, thermal and mechanical simulations when necessary.
- Conduct DRC checks in accordance with e2v methodologies.
- Conduct different design reviews including the final one before ordering the package.
- Assume the role of design expert with respect to assembly houses (assembly instructions…)
- Ensure technical interface with package vendors and assembly houses: Guide technical reviews with package vendors.
- Technical Identification and evaluation of new vendors.
- Technology monitoring: Maintain a technology watch on future generations of imaging packages.
- Identify and lead R&D or continuous improvement projects on these technologies.
Requirements
- Background in microelectronics, in electronics (preferred), material science or micromechanics
- First confirmed experience in packaging design. Specific experience in imaging and/or assembly would be a serious plus.
- Mastering of package design flow: specification, identifying solutions, design, validation.
- Mastering packaging layout meeting signal/power integrity aspects (under Cadence APD or equivalent).
- Knowledge basic mechanical design (Solid works or equivalent).
- Experience in technical management of package vendors and assembly houses.
- A strong advantage would be Knowledge in electrical modelisation (parasitic extraction under Cadence Xtract IM, Spice, Ansys).
- knowledge in thermal simulations (Ansys workbench, Solid works).
- An experience in system and sub-system development.
- A good level of English (B2 minimum) and French both oral and written. Spanish would be a plus.
Benefits
- Join an innovation‑driven environment in the Grenoble ecosystem, awarded 2026 European Capital of Innovation
- Evolve within a human‑scale site where your contribution truly matters
- Build your career through multiple development paths: technical expertise, project management, and international exposure within the Teledyne group (15,000 employees worldwide)
- Enjoy a structured onboarding program with a dedicated mentor
- Work in an attractive and flexible environment: teleworking agreement and real work–life balance
- Join a company deeply committed to QHSE/CSR goals (2025–2030): “40 by 40” carbon plan, Gold‑level Pro Vélo certification, support to Handisport and Adapted Sport leagues
- Be part of a culture built on respect, integrity, responsibility and citizenship
- Evolve in a company committed to gender equality (score: 93/100)
- Live in a unique Alpine environment, combining technological excellence with excellent quality of life
Job title
Job type
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Not specified
Degree requirement
Tech skills
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