Yield Systems Engineer developing yield analysis software solutions for Intel's advanced packaging roadmap. Collaborating with partners and leading projects in defect data and yield analysis.
Responsibilities
Adapt, develop, deploy and sustain yield analysis software solutions
Drive aspects of Advanced Packaging's inline defect data pipeline workflows
Work closely with partners from automation, metrology, yield/defmet and manufacturing on requirements, enabling, testing and debugging
Contribute to system integration projects for enhancing advanced packaging capabilities in Klarity / Exensio / custom solutions
Lead enabling / debugging projects, role modeling effective problem solving
Demonstrate a strong sense of ownership and quality to drive for mutually effective solutions
Requirements
Possess a Bachelor's Degree in Engineering, Computer Science, Data Science, Information Systems, Chemistry, Physics, Materials Science or any related technical discipline with 3+ years of relevant experience -OR- Master's degree with 2+ years -OR- PhD degree with 1+ year
Experience in Python or comparable programming language
Strong problem-solving and teamwork skills
Experience with Intel's wafer defect metrology and analysis ecosystem
Previous related work experience in a semiconductor foundry (preferred)
Experience with Industry standard Defect and Yield Analysis applications like Klarity or Exensio
Yield improvement or defect metrology / defect reduction experience
Experience with ADC (Automated Defect Classification) and Machine Learning / AI
Experience with modern distributed version control systems, particularly Git, GitLab, or GitHub
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