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About the role
- Packaging Module Development Engineer developing innovative packaging solutions at Intel. Collaborating with teams to advance semiconductor technology and meet industry standards.
Responsibilities
- Design and develop advanced packaging solutions, ensuring alignment with performance, reliability, and quality standards.
- Collaborate with cross-functional teams to optimize package architecture and designs for product integration.
- Conduct finite element analyses and reliability modeling to evaluate packaging performance and ensure robustness.
- Apply geometric dimensioning and tolerancing principles to achieve precision in mechanical design and tolerance analysis.
- Support the integration of sockets and connectors into packaging designs, maintaining high-level functionality and manufacturability.
- Drive quality assurance processes and reliability measurements to mitigate risks and ensure product success.
- Leverage surface mount and mechanical design techniques to innovate and refine packaging modules that meet industry standards.
- Solve complex technical challenges related to packaging mechanics and deliver solutions that align with Intel's product roadmap.
Requirements
- Bachelor's degree in Mechanical Engineering, Material Science, or a related STEM field
- 4 or more years of experience in packaging design, development, or related areas
- 1 + years of experience with socket and connector in packaging development
- 1 + years of familiarity with surface mount techniques and packaging mechanics
Benefits
- competitive pay
- stock bonuses
- health
- retirement
- vacation
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