Onsite Director, Advanced Package and 3DIC Solutions

Posted 5 days ago

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About the role

  • Director leading the development of advanced packaging and 3DIC solutions for Cadence, working closely with R&D and engineering teams to establish strong customer relationships.

Responsibilities

  • defining and leading the development of advanced packaging and 3DIC implementation flows for foundry and customer solutions
  • develop excellent working relationships with Cadence R&D and product engineering teams as well as customers
  • management responsibilities may be added to this role as the 3DIC services team is staffed up
  • implement bondwires, bumps and 3D structures and designs

Requirements

  • Bachelor’s degree (Masters preferred) in Electrical or Electronics Engineering
  • Minimum 20 years experience with package design
  • 10 years experience as an APD expert
  • Strong knowledge of advanced packaging concepts
  • Strong knowledge of 2.5D, 3DIC and stacked die technologies
  • Understanding of chip level CMOS design concepts desired
  • Good programming knowledge with Allegro Skill and Ravel a plus
  • Strong customer-facing communication and problem-solving skills
  • Strong personal drive for continuous learning and expanding professional skill sets
  • Excellent verbal and written communication skills

Benefits

  • paid vacation and paid holidays
  • 401(k) plan with employer match
  • employee stock purchase plan
  • a variety of medical, dental and vision plan options
  • more

Job title

Director, Advanced Package and 3DIC Solutions

Job type

Experience level

Lead

Salary

$157,500 - $292,500 per year

Degree requirement

Bachelor's Degree

Location requirements

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