Director leading the development of advanced packaging and 3DIC solutions for Cadence, working closely with R&D and engineering teams to establish strong customer relationships.
Responsibilities
defining and leading the development of advanced packaging and 3DIC implementation flows for foundry and customer solutions
develop excellent working relationships with Cadence R&D and product engineering teams as well as customers
management responsibilities may be added to this role as the 3DIC services team is staffed up
implement bondwires, bumps and 3D structures and designs
Requirements
Bachelor’s degree (Masters preferred) in Electrical or Electronics Engineering
Minimum 20 years experience with package design
10 years experience as an APD expert
Strong knowledge of advanced packaging concepts
Strong knowledge of 2.5D, 3DIC and stacked die technologies
Understanding of chip level CMOS design concepts desired
Good programming knowledge with Allegro Skill and Ravel a plus
Strong customer-facing communication and problem-solving skills
Strong personal drive for continuous learning and expanding professional skill sets
Excellent verbal and written communication skills
Benefits
paid vacation and paid holidays
401(k) plan with employer match
employee stock purchase plan
a variety of medical, dental and vision plan options
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