Security Solutions Architect developing consultative solution designs at Verinext, a technology solutions provider. Engaging with customers across various sectors to optimize technology investments.
About the role
- Principal Manufacturing Integration Engineer overseeing product/process integration in semiconductor manufacturing. Collaborating across teams to enhance yield, performance, and cycle time.
Responsibilities
- Own, manage and improve process control plan for new and existing products.
- Collaborate with development and process engineering teams to introduce new technologies into high-volume manufacturing.
- Lead qualification and ramp-up activities for new products and processes.
- Analyze inline metrology, process data and defectivity trends to identify root causes of process shift or excursion.
- Drive corrective actions and continuous improvement projects across multiple process areas.
- Act as the primary interface between development, process, and manufacturing teams.
Requirements
- PhD in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or
- 8+ years in semiconductor wafer fabrication, hands-on experience with wafer process, strong background in process integration.
- Strong analytical and problem-solving skills; proficiency in data analysis tools (e.g., JMP, Python).
- Excellent communication and leadership abilities to manage cross-functional teams.
- Knowledge of SPC, DOE, and yield enhancement methodologies.
- Experience in high-volume manufacturing environment.
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