Hybrid Advanced Packaging Design Engineer

Posted 6 hours ago

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About the role

  • Staff Engineer leading innovative packaging solutions for semiconductor technology, focusing on high performance computing, AI, and networking solutions. Responsible for managing project teams and supplier interfaces to ensure manufacturability and compliance.

Responsibilities

  • Lead small project teams of design and simulation engineers to deliver innovative high quality packaging solutions
  • Interface with package suppliers to select package technology to ensure manufacturability, and compliance with performance, reliability, and cost requirements

Requirements

  • Experience in substrate and/or board design for package technologies
  • Proven ability to lead complex projects involving cross-functional stakeholders
  • Basic usage of tools and workflows in Cadence Allegro (3DIC/ISP/APD/SiP)
  • Bachelor’s degree in electrical engineering or related fields and 5+ years of related professional experience
  • Master’s or PhD degree with IC / Packaging focus preferred
  • Experience with current generation HBM, DDR, SerDes, D2D, D2H, ADC, DAC, PCIE, Ethernet, etc
  • Good understanding of signal and power integrity at substrates, board, package, and system level
  • Understanding of advanced 2.5D/3D package technology including (a) CoWoS-S/R/L, (b) EMIB, (c) CPO, (d) CPC
  • Familiarity in tools and workflows: Cadence Sigrity/Clarity/Innovus/Virtuoso, Ansys, AutoCAD, SolidWorks
  • Experience contributing to tool, process, and flow development, library maintenance
  • Experience interacting with chip design and electrical simulation teams to optimize the design
  • Familiarity with running and interpreting signal and power simulations is a plus
  • Ability to manage programs involving cross-functional teams

Benefits

  • Employee stock purchase plan with a 2-year look back
  • Family support programs to help balance work and home life
  • Robust mental health resources to prioritize emotional well-being
  • Recognition and service awards to celebrate contributions and milestones

Job title

Advanced Packaging Design Engineer

Job type

Experience level

Lead

Salary

$121,000 - $179,040 per year

Degree requirement

Bachelor's Degree

Tech skills

Location requirements

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