DFT Design Engineer at Intel shaping quality and performance of silicon products. Designing and verifying robust DFT features to ensure manufacturability and reliability.
About the role
- Package Design Engineer at Kandou developing scalable AI hardware solutions. Involved in multi-functional collaboration and assurance of design compliance in Hyderabad or Bangalore.
Responsibilities
- Complete all Package design activities within the given time frame as defined by the project deliverables
- Complete Package design review processes with the Assembly subcons to ensure no design rule violations
- Liaise closely with the respective IC layout Engineers during Package design phase
- Complete verification of Electrical characteristics of the package and unit design using available SW Tools
- Ensure cost effective methodologies are incorporated into Kandou’s BGA substrate and LF designs (Multi Layer / Mechanical Drill / Plating Lines etc)
- Provide support, guidance and instructions to Assembly / Package related activities, questions and issues
- Present detailed weekly reports of activities and progress to the cross-functional team
- Work with multi-functional groups including product design, engineering and marketing to ensure our package design/technology requirements are fully supported by Kandou’s assembly partners
Requirements
- Minimum 5 years experience in IC Package Design using Cadence APD / SIP
- Hands on experience using Cadence (Virtuoso / Extract IM / Power DC) / Ansys SW Tools (SiWave / Q3D) or similar tools
- Experience using AutoCAD tool
- Knowledge about various Electronic IC Packaging technology is a must
- Basic understanding of Thermal and Mechanical behaviour of IC Packages
- Basic understanding of IC physical layout is beneficial
Benefits
- Opportunity to work in a growing technology company
- Collaborative work environment
Job title
Job type
Experience level
Salary
Not specified
Degree requirement
Tech skills
Location requirements
CPU Logic Design Engineer designing high - performance microprocessors at Intel. Collaborating on cutting - edge logic designs and optimizing CPU performance across industries.
Mechanical Engineer at EnerSys evaluating and improving manufacturing processes. Focusing on product quality and efficiency enhancements.
Senior Roadway Design Engineer focused on civil engineering design for transportation projects. Responsible for preparing construction documents and collaborating with project teams in Cincinnati, OH.
Roadway Design Engineer responsible for civil roadway design and infrastructure analysis in Cincinnati. Engaging in plans, drawings, and supporting documents for transportation projects in Ohio.
Entry - level Structural Design Engineer in Precast Concrete Engineering Group, collaborating on large commercial projects and contributing to design solutions. Focus on learning and professional development through practical experience.
Structural Design Engineer designing precast/prestressed concrete products for large commercial buildings. Collaborating within teams to maintain quality and deadlines in projects while enhancing personal skills.
Engineering Intern assisting Engineers with orders and CAD designs in a manufacturing environment. Collaborating in process improvements and product development under the Conveyance business segment.
Structural Design Engineer III developing launch vehicle components for Blue Origin's New Glenn. Collaborate on design and testing of aerospace structures while ensuring hardware integration and performance.
Structural Design Engineer supporting the design and development of Blue Origin's New Glenn launch vehicle. Hands - on ownership of structural components from concept through launch with a collaborative engineering team.