Engineer developing hybrid bonding technology for semiconductor chips at Applied Materials. Focus on process development, optimization, and collaboration with partners in a cutting-edge lab setting.
Responsibilities
Develop pretreatment processes for both conventional and unconventional test vehicles in CoW hybrid bonding applications
Propose solutions to address the unique challenges for high-yield hybrid bonding and die stacking
Proactively initiate and conduct CnF tests to define process & hardware requirements
Collaborate with partners to evaluate different pretreatment technologies to identify the best for HBM
Deep dive with engineering team and/or supplier to prototype next gen pretreatment modules based on identified technology and process & hardware requirements
Evaluate proto chamber for hybrid bonding process for HBM
Own process optimization and drive engineering improvement
Guide account/field teams on tough technical issues
Requirements
Engineering or science university educational background
Academic background on plasma, wet clean, and/or thermal module is a plus
Prior hands-on experience with industrial and/or lab-scale plasma or wet cleans tools and processes is a strong plus
15% travel commitment to the US, Taiwan, Korea or Europe
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