Onsite Bonding Technology Development Engineer

Posted 2 hours ago

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About the role

  • Engineer developing hybrid bonding technology for semiconductor chips at Applied Materials. Focus on process development, optimization, and collaboration with partners in a cutting-edge lab setting.

Responsibilities

  • Develop pretreatment processes for both conventional and unconventional test vehicles in CoW hybrid bonding applications
  • Propose solutions to address the unique challenges for high-yield hybrid bonding and die stacking
  • Proactively initiate and conduct CnF tests to define process & hardware requirements
  • Collaborate with partners to evaluate different pretreatment technologies to identify the best for HBM
  • Deep dive with engineering team and/or supplier to prototype next gen pretreatment modules based on identified technology and process & hardware requirements
  • Evaluate proto chamber for hybrid bonding process for HBM
  • Own process optimization and drive engineering improvement
  • Guide account/field teams on tough technical issues

Requirements

  • Engineering or science university educational background
  • Academic background on plasma, wet clean, and/or thermal module is a plus
  • Prior hands-on experience with industrial and/or lab-scale plasma or wet cleans tools and processes is a strong plus
  • 15% travel commitment to the US, Taiwan, Korea or Europe

Benefits

  • supportive work culture
  • health and wellbeing programs
  • personal and professional growth support

Job title

Bonding Technology Development Engineer

Job type

Experience level

Mid levelSenior

Salary

Not specified

Degree requirement

Bachelor's Degree

Location requirements

OnsiteSingapore

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