About the role

Principal Hardware Architect defining and driving the hardware architecture for GM’s next-generation vehicle platforms. Leading tradeoff analysis and collaborating across hardware, software, and vehicle architecture teams.

Responsibilities

Define and evolve GM’s zonal hardware architecture, balancing performance, cost, scalability, and reliability.
Lead tradeoff analysis across compute partitioning, networking, harnessing, and ECU design.
Translate semiconductor technology roadmaps into platform-level hardware requirements.
Define physical layer network topology and constraints for in-vehicle communication (Ethernet, CAN, LIN, PCIe, etc.).
Decompose system-level requirements into ECU- and harness-level specifications.
Collaborate with software architects to align hardware and software partitioning on microprocessors.
Define ECU hardware design requirements, including power, thermal, and signal integrity considerations.
Provide guidance on high-speed PCB design and layout best practices.
Ensure manufacturability, reliability, and compliance with automotive standards.
Partner with vehicle architecture, system architecture, software, and semiconductor teams to ensure cohesive system design.
Serve as a technical authority and mentor for hardware engineering teams.
Influence supplier and technology partner roadmaps to align with GM’s long-term strategy.
Drive adoption of new technologies, tools, and methodologies in hardware architecture.

Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field.
12+ years of experience in hardware/system architecture, with significant experience in automotive or other high-reliability industries.
Proven track record of defining and delivering complex hardware architectures at scale.
Deep understanding of zonal architectures and vehicle E/E tradeoffs.
Strong knowledge of software partitioning on microprocessors and its hardware implications.
Expertise in physical layer network topology (Ethernet, CAN, LIN, PCIe, SerDes) and constraints.
Ability to map semiconductor technology capabilities to physical layer and harness requirements.
Strong background in high-speed PCB design and layout.
Thorough understanding of vehicle architectures and tradeoff analysis.
Ability to influence cross-functional teams and drive alignment across hardware, software, and vehicle architecture.
Strong communication skills for engaging with technical and executive stakeholders.
Experience mentoring and guiding engineering teams.