Process Integration Expert at Nearfield Instruments applying expertise in CMP, advanced packaging, and hybrid bonding. Collaborating with researchers and partners to develop innovative metrology solutions.
Responsibilities
Apply deep process expertise in CMP, packaging, and bonding to define requirements for advanced metrology solutions.
Translate challenges such as planarization (CMP), interconnect scaling (packaging), and bonding interface quality (hybrid bonding) into measurable metrology targets.
Collaborate with system architects, AFM/optical experts, and computational scientists to design metrology approaches that tackle high-aspect ratio structures, alignment, dishing/erosion, voids, warpage, and interface defectivity.
Work closely with leading semiconductor fabs and packaging partners to validate metrology concepts in real-world manufacturing.
Act as the in-house process integration expert, bridging the gap between semiconductor manufacturing processes and next-generation metrology.
Requirements
PhD or MSc in Materials Science, Physics, Mechanical/Electrical/Chemical Engineering, or related field.
Proven expertise in at least two of the following areas (ideally all three): CMP (Chemical Mechanical Polishing) – planarization, defectivity, dishing, erosion.
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