Sr. Application Architect responsible for contract funding applications. Joining a forward - thinking team at Daimler Truck Financial in Charlotte, NC.
About the role
- Memory Subsystem Architect at Micron focusing on next-gen HBM DRAM products. Collaborating with varied teams to innovate memory subsystem architectures.
Responsibilities
- Design & develop next generation HBM DRAM products
- Collaborate with internal and external partners to develop novel architectures and detailed IP requirements
- Lead engagement with IP vendors, including evaluation and selection of interface and functional IP
- Analyze benchmarks, workloads, and simulations to identify opportunities for performance, efficiency, and architectural innovation
- Partner with RTL, validation, and product teams to ensure timely and successful implementation
- Drive microarchitecture definition and participate in performance simulation and benchmarking
Requirements
- Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field
- Minimum of 15 years of experience in memory subsystem architecture and design
- Deep understanding of memory controller design and memory types (DDR, LPDDR, GDDR, HBM)
- Experience with PHY design and understanding of signal integrity issues
- Proficiency in Network-on-Chip (NoC) architecture and design
- Familiarity with industry-standard bus protocols such as AXI, AMBA, AHB, DFI, etc.
- Strong analytical and problem-solving skills
- Excellent written and verbal communication skills.
Benefits
- Health insurance
- Dental and vision plans
- Paid family leave
- Paid time-off program
- Paid holidays
- Income protection programs
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