Design Engineer responsible for collaborating on designs for exhibits and corporate environments at STAR. Leading project planning and execution with a focus on client satisfaction and timelines.
About the role
- Package Designer with expertise in semiconductor packaging design driving Marvell’s Photonic Fabric Package solutions. Collaborating with cross-functional teams for design manufacturability and reliability.
Responsibilities
- Lead Si/package/PCB/system co-design work collaborating with downstream system design teams and upstream ASIC/PIC designers to develop a portfolio of packages that meets a huge range of performance design points, while optimizing re-use in other Marvell products
- Scope all aspects of package substrate design feasibility for multi-chip SiP packaging
- Lead all aspects of package layout based on I/O, SI-PI and form factor requirements, including routing, design for reliability, thermal, mechanical, manufacturability, bumping, substrate, material selection, assembly, and support for testing
- Meet specifications for high-speed interfaces such as HBM, DDR, PCIe and 56G/112G SerDes
- Netlist management for heterogeneous chiplet assemblies using latest EDA solutions
- Supporting activities related to production and assembly of IC packages with substrate suppliers and OSATs
- Actively participate in qualification of package and board level assembly with sensitivity to physics of failures for high thermo-mechanical reliability, driving appropriate test vehicle definition and design
- Drive ideation and innovation of advanced package solutions and specifications with vendors to advance productization efforts by Marvell
Requirements
- BS/MS/PhD in EE/ECE/MSE/ME/ChemE or related disciplines
- 5-10 years of experience in Semiconductor Packaging Design
- Extensive experience working with advanced packaging design tools such as Cadence APD
- Familiarity with MCAD tools such as AutoCAD
- Familiarity with high density/high performance interconnects in various 2.5D/3D packaging technologies including InFO, CoWoS, FoCoS and EMIB
- Good understanding of cross-functional packaging areas: Si floor plan, package, board layout and architecture, design rules, BOM, enabling material/process technologies, thermal, mechanical, Signal/Power Integrity, design for manufacturing, assembly, reliability, and cost
- Familiarity with photonics packaging is a plus but not necessary
- Proven track record of working with substrate vendors to meet design for manufacturing, yield, and reliability
- Proven track record of engagement with OSATs to meet assembly requirements and drive new developments to meet new product requirements
- Familiarity with High Speed Signaling best practices, Signal and Power integrity requirements
- Strong analytical, problem-solving, cross-functional collaboration, project management, and technical presentation skills.
Benefits
- Employee stock purchase plan with a 2-year look back
- Family support programs to help balance work and home life
- Robust mental health resources to prioritize emotional well-being
- Recognition and service awards to celebrate contributions and milestones
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