Lead development of thermal and mechanical solutions for Data Center CPUs at Intel. Collaborate across teams to optimize thermal management systems and validate models.
Responsibilities
Lead the development of advanced thermal and mechanical solutions for Data Center CPUs
Define product power and temperature limits based on system cooling capabilities
Provide thermal parameters for manufacturing teams
Conduct thermal analysis, design, prototyping, and testing of air and liquid cooling solutions
Collaborate cross-functionally with design, power, reliability, electrical, and mechanical teams
Drive technical readiness through research, experiments, and prototyping
Requirements
Bachelor’s degree in Mechanical Engineering or related field with 10+ years of related experience
8+ years of experience in heat transfer fundamentals for data center or client systems
Thermal testing techniques using sensors and wind tunnels
Thermal simulation software (Flotherm, Icepak)
CFD tools and thermal modeling processes
Proficiency in Python, MATLAB, LabVIEW, and statistical analysis
Hands-on experience with thermal metrology, DOE, instrumentation, and uncertainty analysis
Strong project leadership and cross-functional collaboration skills
Expertise in electronics cooling for systems/platforms, racks, and datacenters
Deep knowledge of TIMs, heat sinks, vapor chambers, heat pipes, fans, and liquid cooling systems
CAD proficiency (SolidWorks or Creo) and CFD experience
Experience managing ODMs/vendors and full product lifecycle from concept to production
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