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TA
Hybrid Senior Technical Program Manager
Posted 4 months ago
About the role
- Leads complex cross-disciplinary initiatives in microsystems technology at Texas Institute for Electronics. Orchestrates collaboration across teams ensuring strategic alignment and timely execution.
Responsibilities
- Lead the planning, execution, and delivery of cross-disciplinary programs supporting TIE’s advanced microsystems roadmap.
- Develop and manage program scopes, schedules, budgets, and risk mitigation plans to ensure predictable delivery across engineering and manufacturing teams.
- Coordinate efforts across internal R&D, process development, design automation, and partner organizations to align execution with technology and business objectives.
- Serve as the central liaison between TIE’s technical teams, university researchers, and external stakeholders—including DoD partners, national labs, and commercial collaborators.
- Drive metrics-based accountability and communication across all program tracks to ensure transparency and stakeholder confidence.
- Identify dependencies, anticipate bottlenecks, and proactively resolve issues to maintain momentum in a fast-moving environment.
- Support the generation of technical documentation, customer deliverables, and integration roadmaps that communicate progress and align with contract requirements.
- Monitor industry trends in advanced packaging, 3DHI, and chiplet-based architectures, informing program direction and partnership strategy.
- Other related functions as assigned.
Requirements
- For Senior Technical Program Manager: 8+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends.
- For Principal Technical Program Manager: 10+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends.
- Education: BS in Electrical Engineering, Computer Engineering, or a related technical discipline.
- Technical Expertise: Proven expertise in advanced packaging technologies (e.g. 2.5D interposers, through-silicon vias, wafer-level packaging, 3D stacking, RDL/interposer technologies) and heterogeneous integration techniques.
- Process & EDA Familiarity: Working knowledge of semiconductor fabrication processes and electronic design automation (EDA) flows for PDK/ADK creation and integration with major EDA vendor flows.
- Exceptional communication skills. You know how to simplify the complex, create clear deliverables, and build trust with both technical and business stakeholders.
- Startup DNA. You’re energized by ambiguity, act with urgency, and take ownership of outcomes. You thrive in a fast-paced, dynamic environment and aren’t afraid to wear many hats to get the job done.
- Execution mindset. You have demonstrated experience driving progress across multiple initiatives in a hands-on role, without the need for layers of management. You plan, execute, and deliver—reliably and proactively.
Benefits
- Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
- Voluntary Vision, Dental, Life, and Disability insurance options
- Generous paid vacation, sick time, and holidays
- Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
- Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
- Flexible spending account options for medical and childcare expenses
- Robust free training access through LinkedIn Learning plus professional conference opportunities
- Tuition assistance
- Expansive employee discount program including athletic tickets
- Free access to UT Austin's libraries and museums with staff ID card
- Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card
Job title
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