Mechanical Engineer developing next generation sensors at Leonardo. Delivering mechanical engineering solutions and supporting product development through engineering lifecycle.
About the role
- IC Design Engineer implementing new technologies for various consumer devices and Satellite projects. Involves high-voltage ASIC design with a focus on physical implementation and verification.
Responsibilities
- Leading and implementing chips in various high-volume consumer devices to Satellite projects from ultra-low power 40nm nodes, 16nm to 7nm
- Physical implementation of the blocks and top-level
- Floorplanning including multi-power domain, PG planning, block-shaping & clock-tree implementation
- Interfacing with internal and external teams, including Design, IPs, and Library
- Physical Verification for block and chip-level
- Static and Dynamic IR drop Analysis
- Signal and Power EM checks
- Methodology & Flow development of Physical Design & Timing Closure
- Working independently with the Synthesis & STA owners and RTL design team on Physical implementation and Power-intent requirements
- Knowledge of ESD, IO padring, Analog integration, and exposure to various types of packages, including flip-chip, wlcsp is a plus
- Knowledge of AI tools preferable
Requirements
- BS (Electrical)+ 12 years or MS (Electrical) +10 years of experience
- Multiple tapeouts experience and extensive hands-on knowledge in various tools such as Innovus, VCLP, Formality, LEC, timing closure, and Calibre
- Cadence Innovus usage is essential
- TCL scripting is required, and Python is a plus
Benefits
- Medical, dental and vision plans
- 401(K) participation including company matching
- Employee Stock Purchase Program (ESPP)
- Employee Assistance Program (EAP)
- Company paid holidays
- Paid sick leave and vacation time
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