Technician Engineer supporting Roads Network Management Services at Fife Council. Investigating solutions for roads problems and managing budgets for projects.
AM
Onsite Process Engineer – Die to Wafer Hybrid Bonding, Silicon Photonics / CPO, R&D
Posted 4 days ago
About the role
- Process Engineer optimizing manufacturing processes for semiconductor and display technologies at Applied Materials. Collaborating with R&D teams to drive innovation in manufacturing processes.
Responsibilities
- design and optimize manufacturing processes for display and semiconductor manufacturing technologies
- collect and analyze data, perform hardware characterization, and troubleshoot engineering issues
- measure film properties, generate technical documentation, and engage with customers to resolve concerns
- collaborate with vendors and suppliers
- experiment and learn on state‑of‑the‑art equipment along with R&D teams
Requirements
- M.S. or Ph.D. in Materials Science, Electrical Engineering, Mechanical Engineering, Applied Physics, or a related STEM discipline
- In‑depth knowledge and hands‑on experience in one or more of the following: Die‑to‑wafer or wafer‑to‑wafer bonding, Thin‑die handling and alignment‑critical processes, Semiconductor processing and 2.5D/3D integration
- Strong understanding of: Bond interface physics, Alignment and overlay fundamentals, Mechanical behavior of thin and fragile dies
- Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP)
- Self‑starter with strong problem‑solving skills; able to work both independently and collaboratively
- Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.
Benefits
- supportive work culture that encourages learning, development, and career growth
- programs and support for health and wellbeing
- opportunities for personal and professional growth
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